| 摘要 |
PURPOSE:To form a solder bump surely and efficiently by a method wherein a solder member is supported by a hole made in a sheet which is not solderable to a molten solder, the solder member is piled up so as to face a conductor for bump use on an insulating substrate and the solder member is heated and bonded to the conductor. CONSTITUTION:A material which is not solderable to a molten solder is used for a ball support sheet 11; a plurality of holes 11a are made. Many solder balls 4 are put in a recessed part of a jig 14; a mask 15, a spacer 16, the ball support sheet 11 and a back plate 17 are mounted one after another on the jig 14; after that, compressed air is blown from the lower part. The balls 4 are levitated; they are passed through holes 15a in the mask 15 and enter the holes 11a in the support sheet 11; they adhere by adhesive power of a flux 12 which has been applied to their sidewalls. In a state that the balls 4 have adhered to all the holes 11a, an insulating substrate 1, the support sheet 11 and the back plate 17 are mounted on a substrate holder 18; this assembly is heated by using a vapor of a fluorocarbon. Thereby, when the balls 4 reach their melting point, they are melted and bumps 5 are surely formed on pads 2. |
