| 摘要 |
PURPOSE: To facilitate bonding by surely fixing and installing a thin film on a working plane by preventing the generation of air current by providing a conductor path, which has a recessed part connected through a hole to the connector of a negative pressure conduit, inside the working plane of a receiving member. CONSTITUTION: When the negative pressure of about -0.8bar is formed through a tube connector, namely, a negative pressure conduit connector 3, a flexible insulated thin film 18, to which a semiconductor chip 19 is connected, provided with the conductor path and a metallic pad 17 is sucked into a ring-shaped recessed part 6. Therefore, the surface of the thin film 18 surrounded with the recessed part 6 is expanded, and the thin film 18 is tightly stuck on the surface of a receiving member 1 to be used as a working plane 20 under the cooperation of other holes 11-16. Thus, after the thin film 18 is fixed, actual bonding is easily performed. |
