发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To avoid short-circuiting of an inner lead due to drooping of a metal thin wire by providing an insulation film at least at the middle of two rows of inner leads. CONSTITUTION:An element-placing part is provided on the bottom surface of a recessed part which is provided at the center inside a ceramic container 1, a first inner lead 2a is provided at the inner periphery part of the upper-stage horizontal surface of the recessed part, and then the inner lead 2a is arranged in zigzag manner at the outer periphery of the inner lead 2a for providing a second lead 2b. Then, a band-shaped insulation film 3 such as polyimide resin is selectively provided at the middle part between the inner lead 2a and the inner lead 2b. Then, a semiconductor chip 4 is mounted at the element- mounting part, thus connecting among the electrode of the semiconductor chip 4 and the inner leads 2a and 2b using a metal thin wire 5. Therefore, a metal thin wire 5 connected to the inner lead 2b is protected by the insulation film 3, thus preventing short-circuiting accident with the inner lead 2a due to drooping.
申请公布号 JPH02278742(A) 申请公布日期 1990.11.15
申请号 JP19890100417 申请日期 1989.04.19
申请人 NEC CORP 发明人 ITO NOBUKAZU
分类号 H01L21/60 主分类号 H01L21/60
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