| 摘要 |
PURPOSE:To prevent a crack from being produced, to enhance moistureproof property and to make a device small-sized by a method wherein tip parts of a plurality of support bars are brought into contact with one pair of side faces of a semiconductor chip and the semiconductor chip and the plurality of support bars are buried in a sealing resin. CONSTITUTION:In a resin-sealed type semiconductor device which contains a semiconductor chip 1, a plurality of support bars 21, 22 and a sealing resin 3, tip parts of the plurality of support bars 21, 22 are brought into contact with one pair of side faces of the semiconductor chip 1; the semiconductor chip 1 and the plurality of support bars 21, 22 are buried in the sealing resin 3. When the semiconductor chip 1 is fixed to a lead frame 4, opposite side faces are held by the tip parts of the support bars 21, 22. Thereby, it is possible to avoid a problem that, after a resin sealing operation, a crack is produced by a difference in a coefficient of th ermal expansion between a conventional die pad and a conventional sealing resin; a moistureproof property of the resin- sealed type semiconductor device is enhanced. In addition, a distance between leads of the lead frame 4 and the semiconductor chip 1 can be made small and miniaturization can be achieved. |
