WIRING STRUCTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS FORMATION,申请号JP19890102128-传众专利搜索

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发明名称	WIRING STRUCTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS FORMATION
摘要
申请公布号	JPH02278827(A)	申请公布日期	1990.11.15
申请号	JP19890102128	申请日期	1989.04.20
申请人	NEC CORP	发明人	MIKAGI IKU
分类号	H01L23/52;H01L21/3205	主分类号	H01L23/52
代理机构		代理人
主权项
地址

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