| 摘要 |
<p>PURPOSE:To prevent an effective area of a chip from being reduced by identification marks and to decipher the identification marks after various treatments in a production process have been repeated by a method wherein the identification marks corresponding to items such as a type name, a lot number, a water number and the like of a semiconductor wafer are put on a side face of the semiconductor water. CONSTITUTION:An orientation flat part 2a which has been cut along a chord is formed in one part of a side face 2 of a semiconductor wafer 1. Identification marks 3 corresponding to at least one or more items such as a type name, a lot number, a wafer number and the like are put on the orientation flat part 2a. Thereby, a circuit element and the like are not formed on the side face of the wafer; a process to treat the side face of the wafer is not executed. Accordingly, it is possible to prevent an effective area of a chip from being reduced by the identification marks; it is possible to decipher the identification marks after various treatments in a production process have been repeated.</p> |
