| 摘要 |
<p>In the present invention a method of testing a partially assembled module (10) with integrated circuit dies (12a, 14a, 16a) mounted thereon is disclosed. The partially assembled module has one or more first locations (12) with dies (12a) mounted thereon and one or more second locations (14, 16) with dies (14a, 16a) to be mounted thereon and one or more paths (18) electrically connecting the first and second locations. A complementary module (110) with one or more electrical components (114a, 116a) assembled in the second locations (114, 116) and with one or more electrical components (112a) to be assembled in the first locations (112) and with identical electrical paths (118) connecting the first and second locations (114, 116) as the testing module (10) is also provided. The testing module (10) and the complementary module (110) are mated together by electrically connecting the first and second locations (12, 14, 16) of the testing module to the first and second locations (112, 114, 116) of the complementary module (110), respectively. The resultant combined module is tested as if it were an assembled module.</p> |
