| 摘要 |
PURPOSE:To obtain the subject compsn. with high Tg and heat distortion temp., excellent electrically insulating properties, adhesive properties, hardness, heat resistance, moisture resistance, chem. resistance, plating resistance, etc., and little bleeding by incorporating a specified epoxy resin. CONSTITUTION:The subject compsn. is obtd. by incorporating an epoxy resin (A) of the formula (wherein R is H or CH3; (n) is 0 or an integer of 1 or larger), a curing agent (B) (e.g. dicyandiamide, imidazole compd., triazine compd., arom. amine compd., etc.) and a solvent (e.g. ethyl cellosolve, diethylene glycol monoacetate, solvent naphtha, etc.). A product with such characteristics as high Tg point, excellent electrically insulating properties, adhesive properties, heat resistance, moisture resistance, chem. resistance, hardness, etc., and little bleeding is obtd. |
