| 摘要 |
<p>PURPOSE:To reduce in size an integrated circuit and to detachably provide an EPROM by placing the EPROM on a substrate, sealing all a microcomputer and peripheral circuit elements with a case material, and exposing only the EPROM in a hole formed at the case material. CONSTITUTION:A case material 8 is formed of thermoplastic resin, and so formed in a box state as to form a space when it is secured to a substrate 2. A hole 7 is formed at a desired position of the material 8, an EPROM 4 is connected to a conductive path on the substrate 2 exposed in the hole 7 through a socket 15, and a microcomputer 5 and other circuit element 6 are secured to the sealing space 14 formed of the substrate 2 and the material 8. A shielding sealing material 16 is adhered to the hole 7 of the material 8 to completely shield a light and to completely seal the EPROM 4. Thus, when data of the EPROM 4 is erased, the material 16 is peeled, the EPROM 4 is removed from the socket 15, and radiated with an ultraviolet ray.</p> |
