发明名称 MANUFACTURE OF ELECTRONIC COMPONENT
摘要 PURPOSE:To facilitate coating of resin and to connect leads of an element having two leads in a low volume state by connecting the leads of the element to a lead frame, bending at 180 deg. between the parts of the frame connected to the leads and the element, and disposing it on the face of the frame. CONSTITUTION:Leads 1 of an element 2 having at least two leads 1 protruding in the same direction are connected to a lead frame 3, the parts of the leads 1, connected to the frame 3 and the element 2 are bent therebetween at 180 deg., and the element 2 is disposed on the frame 3 connected with the leads 1. Thus, the element 2 in which the leads 1 protruding in the same direction and easily preliminarily coated are provided can be used, a specific work required manally and with skill to coat the small element 2 is eliminated, and an electronic component of a low volume state can be obtained easily and inexpensively.
申请公布号 JPH02278708(A) 申请公布日期 1990.11.15
申请号 JP19890099455 申请日期 1989.04.19
申请人 SHOWA DENKO KK 发明人 NAITO KAZUMI;WATABE HARUYOSHI
分类号 H01C17/28;H01G4/228;H01G13/00 主分类号 H01C17/28
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