| 摘要 |
PURPOSE:To increase a connecting strength by interposing solder bumps between electrode faces formed on the upper face of one bare chip and the lower face of the other bare chip, and adhering both electrode faces by melting the bumps. CONSTITUTION:A high temperature solder 13 is supplied to a predetermined part of a solid pattern 11 for placing a LED chip 3 of one bare chip, a LED chip 3 is placed thereon, the solder 13 is thermally melted by reflow soldering, and soldered. Further, flux is supplied to a part for placing a solder bump 5 of a Si chip 4 on the solid pattern 21 of a board 2 to be superposed. The lower face 41 of the chip 4 is opposed to the upper face 31 of the chip 3, and the bump 5 of the chip 4 is placed on the electrode face 33 of the chip 3. Then, when flux is cured by a curing furnace and the bump 5 is further melted by a curing furnace, a hot plate, etc., the electrode faces 33, 42 of the chips 3, 4 are connected. Thus, mechanical, electrical connection reliability can be improved. |
