| 摘要 |
PURPOSE:To expose an identification pattern at an excellent treatment efficiency without causing physical damage to a wafer and without generating dust particles by a method wherein a light-adjustment part is installed to adjust an optimum exposure amount and a arbitrary identification pattern is exposed as an aggregate of dots by means of an opening and shutting operation of a shutter. CONSTITUTION:When an exposure operation of a circuit pattern is started, a movement speed of a wafer 20 is detected by using a speed sensor 8; this speed is sent to a control part 9; the control part 9 computes an optimum exposure amount; a light- adjustment part 5 adjusts the optimum exposure amount. In addition, the control part 9 computes a position of the wafer 20 on the basis of a speed signal and the exposure-elapsed time, and computes the optimum exposure time per dot. The opening and shutting time of individual shutters 14 is transmitted to individual shutter parts 6; the control part 9 constitutes an identification pattern 15, input from an input part 10, as dots. The exposure timing of dots 16 is transmitted to the corresponding shutter parts 6. The individual shutter parts 6 open and shut the respective shutters 14 and expose the identification pattern 15 on a resist on the wafer 20. Thereby, no physical damage is caused to the wafer; a crystal defect and a dislocation are not caused; it is possible to prevent dust particles from being generated. |
