| 摘要 |
PURPOSE:To facilitate the flattening of Al wiring in a contact hole part as well as the detection of an alignment mark by a method wherein a mark hole for mask alignment is formed not to be filled up even if a surface flat Al wiring layer is formed. CONSTITUTION:The depth B of an alignment mark hole 35 formed in the first and second insulating films 32 in the first region (a) of a substrate 31 is made larger than the film thickness of a wiring layer 33 formed on the insulating films 32 so that only a part of the inner alignment mark hole 35 may be filled up with the Al wiring 33. Then, the full inner part of a contact hole 34 in the second insulating film 32 on the second region (b) of the substrate 31 is filled up with the Al wiring layer 33. |
