发明名称 SEMICONDUCTOR INNER CONNECTION DEVICE
摘要 PURPOSE:To enable the stable feed and the cut of wire by a method wherein a front clamper is provided in front of a tool to cut a wire. CONSTITUTION:A tool 1 is fitted to an ultrasonic horn 6, and a wire 2 is inserted into the tool 1. A clamper 3 carries out an opening action through an open-close drive 4 and a closing action by a tension spring 5 to hold the wire 2. Moreover, the clamper 3 makes a longitudinal movement to deliver the wire 2. A front clamper 10 located in front of the tool 1 moves up or down through a up-down slide 8 and makes an opening action through an open-close drive 4 and a closing action by a tension spring 5. After the wire 2 is bonded to a pellet 9 through supersonic, and the front clamper 10 is made to ascend further to cut the wire 2.
申请公布号 JPH02276260(A) 申请公布日期 1990.11.13
申请号 JP19890098008 申请日期 1989.04.17
申请人 NEC KYUSHU LTD 发明人 KIMURA NAOTO
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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