| 摘要 |
PURPOSE:To improve interlayer adhesion and halo resistance by forming a laminate in which outer layer material is arranged at the outermost layer through a prepreg layer at the surface after treating a copper oxide film by spray with acid reducing agent solution after formation at the surface of circuit copper. CONSTITUTION:A laminate is formed in which outer layer material is arranged at the outermost layer through a prepreg layer at the surface of inner layer material after removing a copper oxide film by spray treatment with acid reducing agent solution after formation at the circuit copper of inner layer material where electric circuit are formed at a single-sided or double-sided copper-clad laminate. Hereby, the roughening at the circuit surface of the inner layer material becomes uniform, so the interlayer adhesion can be improved, and since there is no black copper oxide film at the roughened surface, the halo resistance can be improved. |
