| 摘要 |
<p>PURPOSE:To make uniform the laminated height of low-melting point metal layers, such as a solder layer and the like, and to prevent a failure of bonding from generating by a method wherein a gold layer and a metal layer having a melting point of a specified temperature or lower are laminated on an external terminal obtainable by laminating selectively a palladium layer and a nickel alloy layer in order on the wiring metal layer of a semiconductor integrated circuit. CONSTITUTION:A palladium layer 4 is formed on an Al layer 2 which is a bonding pad. Then, a nickel-phosphorus alloy layer 5 is plated in an electroless plating bath. Then, a metal layer 6 is plated with an electroless gold plating solution. Lastly, the layers 2, 4, 5 and 6 are dipped into a heated solder bath while being applied ultrasonic waves to laminate a solder layer 7 having a melting point of 350 deg.C or lower and a bump is manufactured.</p> |
