| 摘要 |
PURPOSE:To improve interlayer adhesion and halo resistance by forming a laminate in which outer layer material is arranged at the outermost layer through a prepreg layer at the surface after treating the surface of circuit copper with silane coupling agent. CONSTITUTION:A laminate is formed in which outer layer material is arranged at the outermost layer through a prepreg layer at the surface of inner layer material after treating the surface of circuit copper of inner layer material, where electric circuits are formed at a single-sided or double-sided copper-clad laminate, by spray, etc., using solution wherein silane coupling agent is dissolved or dispersed in solvent such as water, etc. Hereby, the adhesion at the circuit surface of the inner layer material can be improved, and since there is no black copper oxide film at the surface, the halo resistance can be improved. |
