| 摘要 |
PURPOSE:To improve interlayer adhesion and halo resistance by forming a laminate in which outer layer material is arranged at the outermost layer through a prepreg layer at the surface after applying bismuth-containing plating at the surface of circuit copper so as to precipitate eutectoid of bismuth and copper. CONSTITUTION:A laminate is formed in which outer layer material is arranged at the outermost layer through a prepreg layer at the surface of inner layer material after applying bismuth-containing copper plating on the surface of circuit copper of the inner layer material where electric circuits are formed at a single-sided or double-sided copper-clad laminate so as to precipitate the fine and uneven eutectoid of bismuth and copper at the surface of circuit copper. Hereby, the adhesion at the circuit surface of the inner layer material can be improved, and since there is no black copper oxide film at the surface, halo resistance can be improved. |
