RESIN SEALED TRANSFER MOLD FOR SEMICONDUCTOR,申请号JP19890098007-传众专利搜索

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发明名称	RESIN SEALED TRANSFER MOLD FOR SEMICONDUCTOR
摘要
申请公布号	JPH02276257(A)	申请公布日期	1990.11.13
申请号	JP19890098007	申请日期	1989.04.17
申请人	NEC KYUSHU LTD	发明人	MURAI NAOYUKI
分类号	H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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