| 摘要 |
PURPOSE:To enable a bump to effectively break through a metal oxide film naturally formed on the surface of a pad and to assist the pad in metal bonding with the bump so as to enhance a film carrier mounting method in degree of freedom of design by a method wherein the surface of the bump formed at the tip of a finger lead is formed rugged. CONSTITUTION:A bump 2 whose surface is not flat is formed on the tip of a finger lead 1. When an IC pad 3 of an IC chip 1 is bonded to the bump 2 formed on the tip of the finger lead 2, as the surface of the bump 2 is not flat, the bump 2 effectively breaks through a metal oxide film 5 naturally formed on the surface of the pad 3 to bring the metal of the bump 2 into direct contact with the metal of the pad 3, so that an excellent bonding can be realized. |
