发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To restrain the thermal expansion of a bonding arm caused by heat released from a heater so as to prevent the deviation of bonding positions and the failure of an ultrasonic bonding by a method wherein the bonding arm is cooled down by cooling air. CONSTITUTION:A pipe 2 provided with a few small holes 1 is fitted adjacent to an arm 5, and cooling air blowing off from the small holes 1 of the pipe 2 is made to blow against the arm 5 to keep it constant in temperature. Air supplied to the pipe 2 can be obtained from an air conditioner installed outside this wire bonding device.
申请公布号 JPH02276258(A) 申请公布日期 1990.11.13
申请号 JP19890098020 申请日期 1989.04.17
申请人 NEC KYUSHU LTD 发明人 EGUCHI KATSUMI
分类号 H01L21/60 主分类号 H01L21/60
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