首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
BONDING METHOD OF METAL AND NONMETAL
摘要
申请公布号
JPH02275782(A)
申请公布日期
1990.11.09
申请号
JP19890095147
申请日期
1989.04.17
申请人
HITACHI LTD
发明人
TAKAHASHI KENJI;ISHII KOICHI
分类号
B23K20/00;B23K20/08;C04B37/02
主分类号
B23K20/00
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Customer premises equipment diagnostic, recovery, and reporting systems and methods
Storage subsystem and method for recovering data in storage subsystem
Method for switching application server, management computer, and storage medium storing program
Software application placement based on failure correlation
Power supply device and image forming apparatus
Auto-detect polling for correct handshake to USB client
Method, system and apparatus for establishing communication
Privacy-enhanced E-passport authentication protocol
Systems and methods for authenticating mobile devices
Facilitating access control in peer-to-peer overlay networks
Use of application identifier and encrypted password for application service access
Hash table organization
Systems and methods for accelerated loading of operating systems and application programs
Dynamic detection and reduction of unaligned I/O operations
Low access time indirect memory accesses
Technique to avoid cascaded hot spotting
Storage system comprising multiple storage apparatuses with both storage virtualization function and capacity virtualization function
Apparatus and method for using a page buffer of a memory device as a temporary cache
System and method of garbage collection in a memory device
Bridging board and server system