| 摘要 |
PURPOSE: To obtain a drip coating compound for electric and electronic devices which has a low coefficient of thermal expansion by using a drip coating compound based upon epoxy resin which can set with cations. CONSTITUTION: A cation-settable epoxy resin mixture which has glass transition temperature of >=140 deg.C in a set state has a 150μm maximum grain size and a grain size distribution suitable for spatial packing which is as close as possible. This mixture contains a UV-beam transmissive particulate filler which is suitable to a cation setting process, an optical initiator for the cation setting process, and other additives which are known themselves and normally used for an epoxy resin compound at need, and the filler components are 30 to 80vol.%. Consequently, a high volume filling degree and a low coefficient of expansion are obtained as well as the coefficient of expansion of 20ppm/K and below within a temperature range of the room temperature to 90 deg.C. |
