发明名称 SEMICONDUCTOR PACKAGE AND ITS SEALING METHOD
摘要 PURPOSE:To improve the compatibility of adhesive agent to a bonding part and a lid, and prevent the generation of voids by a method wherein bonding is performed while the lid is pressed with pressure on the bonding part and subjected to pivotary turning on a concentric circle. CONSTITUTION:A ring type bonding part is formed on a package main body 2; while a lid is pressed with pressure on the bonding part where adhesive agent is interposed, and subjected to pivotary turning on concentric circles, bonding is performed. On the upper edge 2a of the package main body 2, a metallized part 2a being a bonding part to the lid 3 is formed; when the package main body 2 is sealed, adhesive agent 6 constituted of seal type eutectic alloy and like is mounted on the metallized part 2a; while the whole part is heated, the lid 3 is pressed with pressure on the metallized part 2a and bonded. The metallized part 2a and the adhesive agent 6 have the same shape and are formed in ring types. The adhesive agent 6 is melted between the metallized part 2a and the lid 3 by heating and compression bonding, and constitues a ring type leak path R by eutectic binding. Thereby bonding of little leak is realized, and sealing properties can be improved.
申请公布号 JPH02273958(A) 申请公布日期 1990.11.08
申请号 JP19890096811 申请日期 1989.04.17
申请人 SUMITOMO ELECTRIC IND LTD 发明人 NISHIGUCHI KATSUNORI
分类号 H01L23/02;H01L21/00;H01L21/50;H01L23/10 主分类号 H01L23/02
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