发明名称 BONDING DEVICE
摘要 PURPOSE:To reduce vibration of a bonding system and to perform wire bonding correctly and with a high speed by a method wherein a bonding arm is coupled to the upward and downward driving part by non-contact using a mechanism utilizing injection force of a fluid. CONSTITUTION:A bonding head 14 is provided on an X-Y table 12 on a fundation plate 10, and the arm 16 having a capillary 18 is fixed to the head 14. Coupling between the arm upward and downward driving part containing a motor 22 and the arm 16 is attained by blasting high pressure air 30 from hose 28 linked to an air blast member 26 toward both the upper and lower sides of a plate 32 to hold the plate 32 between the member 26 not coming in contact with the plate thereof. Accordingly even when the plate 32 transfers a little in the forward and backward, rightward and leftward directions, the member 26 is not transferred, and a link 34 and the arm 16 can be moved upward and downward according to upward and downward motion of a link 24 driven by the motor 22. By this constitution, because weight of the arm upward and downward driving part like the motor 22, etc., is not applied directly on the X-Y table 12, the X-Y table can be formed in a small type, and because vibration of the system can be reduced sharply, high speed bonding can be perfomed correctly.
申请公布号 JPS57211241(A) 申请公布日期 1982.12.25
申请号 JP19810095352 申请日期 1981.06.22
申请人 HITACHI SEISAKUSHO KK;HITACHI OUME DENSHI KK 发明人 YAMAZAKI ISAMU;ISHII YASUSHI;WATANABE KENJI
分类号 H01L21/60 主分类号 H01L21/60
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