发明名称 FIELD-ASSISTED BONDING
摘要 The invention relates to a method of bonding together two workpieces, of which at least one is (or has a surface which is) of a material which is electrically substantially non-conductive, by the field-assisted bonding process known as electrostatic bonding which comprises the steps of positioning the workpieces in contact with one another at a common interface, maintaining at least their interface at an elevated temperature, applying a substantial first voltage between them so as to establish at the interface an electrostatic attraction which forces the workpiece surfaces into intimate contact with one another and causes them to bond to one another, and thereafter removing the applied voltage and allowing the workpieces to cool. According to the invention this process is improved by including the additional step, after application of the first voltage and while still maintaining the said interface at elevated temperature, of applying between the workpieces a second voltage of opposite polarity to the first voltage.
申请公布号 GB9020908(D0) 申请公布日期 1990.11.07
申请号 GB19900020908 申请日期 1990.09.26
申请人 NATIONAL RESEARCH DEVELOPMENT CORPORATION 发明人
分类号 H01L21/52;H01L21/20;H01L21/58;H01L29/84 主分类号 H01L21/52
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