| 摘要 |
<p>PURPOSE:To further shorten the time required to cut and divide a semiconductor wafer by a method wherein two stages which are run relatively are installed on both sides of a blade. CONSTITUTION:Semiconductor wafers 1 which have been loaded onto individual stages 3 are aligned accurately by using recognition cameras 5; prescribed cutting amounts are set by using Z-axis driving mechanisms 10 of the individual stages 3; the stages 3 are run in directions of individual arrows 8a by using X-axis driving mechanisms 6; rectilinear cutting lines are formed on the semiconductor wafers 1. Then, the stages 3 are returned to their original positions by using the Z-axis driving mechanisms 10; a blade 4 is moved in a Y-axis direction by a prescribed distance; a cutting amount is given to the blade 4; the stages 3 are run; cutting lines parallel to the cutting lines are formed. These operations are repeated; a cutting operation in one direction of the semiconductor wafers 1 is completed. Then, the stages 3 are turned by 90 deg. by using rotation driving mechanisms 7; the semiconductor wafers 1 are cut and divided in the same manner as mentioned above. Thereby, it is possible to enhance a cutting efficiency.</p> |
