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经营范围
发明名称
REFLOW SOLDER PLATING MATERIAL
摘要
申请公布号
JPH02270987(A)
申请公布日期
1990.11.06
申请号
JP19890089673
申请日期
1989.04.11
申请人
NIPPON MINING CO LTD
发明人
MURATA MASATERU;FUKAMACHI KAZUHIKO
分类号
C25D5/26;C25D5/50
主分类号
C25D5/26
代理机构
代理人
主权项
地址
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