| 摘要 |
<p>PURPOSE:To prevent a contamination in a posterior process and to prevent a dicing cutter from being worn away by a method wherein a conductive material inside a contact hole is left and the conductive material inside an opening part is removed by a nondirectional etching operation. CONSTITUTION:A contact hole and an opening part whose area is larger than that of the contact hole are formed in an insulating layer which has been applied onto a water; the contact hole end the opening part are filled with a conductive material; the conductive material inside the contact bole is left and the conductive material inside the opening part is removed by a nondirectional etching operation. That is to say, when a nondirectional plasma etching operation is executed, tungsten which has been filled into the contact hole of a large aspect ratio is hardly etched and is left; contrary to this, tungsten in a part of a small aspect ratio such as a scribing line or the like is removed completely. Thereby, it is possible to prevent a contamination in a posterior process and to prevent a dicing cutter from being worn away.</p> |
