| 摘要 |
<p>PURPOSE:To obtain an IC card preventing the charge with static electricity and capable of also shielding foreign electric wave noise by bonding a metal nameplate equipped with a design having an integrated structure to the surfaces of substrates. CONSTITUTION:A circuit board 3 having a semiconductor part mounted thereon is received in substrates 1, 2 and these substrates 1, 2 are bonded and assembled by an adhesive and the rear part 4e coated with an adhesive of a metal nameplate 4 is applied to the rear side surface parts 1a, 2a of the substrates 1, 2 of an IC card to bond the rear part 4d of the metal nameplate 4 to the surface of the substrate 1 and, thereafter, the rear part 4f of the metal nameplate 4 is bonded to the surface of the substrate 2 to complete the IC card. As a result, even when the substrates made of a resin are ready to be charged, said substrates are not charged because of the discharge through the metal nameplate 4 and the destruction or erroneous operation of the semiconductor part mounted on the circuit board due to static electricity can be prevented and the metal nameplate becomes an electric wave shield and the IC card capable of shielding noise such as a foreign electric wave can be obtained.</p> |
