| 摘要 |
PURPOSE:To make leads, which are connected to the electrodes of a semiconductor element through wire-bonding, small in resistance so as to make the malfunction and the failure of a semiconductor device of this design hardly happen by a method wherein the lead of a lead frame is made to ramify into two or more pieces near the semiconductor device and the ramified lead pieces are connected to two or more electrodes of the semiconductor device. CONSTITUTION:Leads 4 of a lead frame connected to the electrode of a semiconductor element 1 are ramified into two or more pieces near the semiconductor element 1 and the ramified lead pieces are connected to two or more electrodes of the semiconductor element 1. For instance, lead groups 3 and 4 are connected with the electrodes of the semiconductor element 1 through wire bonding. Each external lead 6 of the lead group 3 is connected to an electrode through an inner lead by wire-bonding, and each external lead of the group 4 is ramified into two or three pieces within a resin sealing range and the ramified lead pieces are connected to two or three electrodes. Two or three electrodes are those which the same signal or signals of the same level are inputted into.
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