发明名称 |
SELF-ADHESIVE COMPOSITION ADHERENT TO DIE |
摘要 |
<p>A composition for bonding integrated circuits to inorganic dielectric substrates comprising an admixture of finely divided particles of a thermally conductive metal or metal-containing compound, amorphous glass frit and fatty acid-based surfactant dispersed in a primary organic solvent selected from ethylene glycol monobutyl ether acetate, dimethyl adipate and mixtures thereof and optionally minor amounts of certain secondary solvents.</p> |
申请公布号 |
JPH02269172(A) |
申请公布日期 |
1990.11.02 |
申请号 |
JP19880056477 |
申请日期 |
1988.03.11 |
申请人 |
E I DU PONT DE NEMOURS & CO |
发明人 |
SARA TORITSUGU JIYOSURIN;KURISUTEIINU MEARII ROOSERU;JIEROOMU DEBITSUTO SUMISU |
分类号 |
C03C8/24;C09J133/04;C09J133/06;H01L21/52;H01L21/58 |
主分类号 |
C03C8/24 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|