| 摘要 |
<p>PURPOSE:To paste up a wafer on a tape by supplying a wafer on a sticking surface of a sticking tape holding a pattern face upward and scanning a pressurized gas nozzle containing ions on the upper side. CONSTITUTION:A semiconductor wafer 1 is supplied to a paste-up part while holding a pattern face upward by a conveyer 2. A guide roller 3 supplies a tape 4 holding a sticking face upward on a level with the conveyer 2. A nozzle 5 having the longer width than a diameter of the wafer 1 is arranged directly on the roller 3 at the distance of several mm. A static change reducer 6 of an ion source is provided inside the nozzle, while ions generated by discharge upon impressing with high-tension voltage are sprayed on the wafer 1 together with pressurized air introduced into the nozzle 5. The tape 4 is fed at low speed under spray of pressurized air containing ions to press the wafer from one end to the other surface. Since pressurized air contains ions, a circuit element is protected from electrostatic breakdown.</p> |
