发明名称 MULTILAYER CIRCUIT SUBSTRATE AND MANUFACTURE THEREOF
摘要 PURPOSE:To decrease change with time, e.g. the change of contact resistance for a long period and further, form finer wiring by constructing junction between a connecting conductor of the 1st substrate and conductor patterns of the 2nd substrate so that a desired contact area can be secured effectively. CONSTITUTION:This circuit is equipped with green sheets 10 and 12, i.e., the 1st and 2nd substrates and a conductor pattern 30 is put in a position at which one side face 12 of a green sheet 12 faces to the connecting conductor 16 of the other side face 10b of the green sheet 10 and further, conductor patterns 32 and 34 are disposed to come close to the conductor pattern 30. After these conductor patterns 30, 32, and 34 are formed in this way, insulating layers 36 and 38 are deposited on the conductor patterns 32 and 34. After that, a junction pattern 40 of Ag is joined electrically to the conductor pattern 30; besides, peripheral directional parts are formed by mounting them on the insulating layers 36 and 38. The surface area of the junction pattern 40 are formed so that its area is, for example, twice that of the connecting conductor 16. The change of contact resistance is decreased by such a state of the surface area and finer wiring is thus formed as well.
申请公布号 JPH02267995(A) 申请公布日期 1990.11.01
申请号 JP19890089504 申请日期 1989.04.07
申请人 NGK INSULATORS LTD 发明人 YOSHIKAWA KUNIMITSU
分类号 H05K3/46 主分类号 H05K3/46
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