发明名称 |
APPARATUS AND METHOD FOR FABRICATING PRINTED CIRCUIT BOARDS |
摘要 |
This invention relates to an apparatus and a process for uniformly laminating a conductor (18) to a substrate (15). The conductor can be a printed circuit; the substrate can be any dielectric. The apparatus comprises two platens (10, 11) containing cavities (12, 13). One of the cavities (13) contains a mold (14) which is the mirror image of a substrate surface. The other cavity (12) substantially contains the substrate (15). It can have two-dimensional or three-dimensional surfaces to which the printed circuit is laminated. The product results in a superior lamination of the printed circuit across the surface of the substrate. |
申请公布号 |
WO9012668(A1) |
申请公布日期 |
1990.11.01 |
申请号 |
WO1990US02139 |
申请日期 |
1990.04.17 |
申请人 |
AMOCO CORPORATION |
发明人 |
SALENSKY, GEORGE, ANTHONY;THOMAN, THOMAS, STEVEN |
分类号 |
B41F16/00;B30B15/02;B30B15/06;B32B37/00;B32B37/10;B41F17/14;H05K1/00;H05K1/03;H05K1/09;H05K3/20;H05K3/38 |
主分类号 |
B41F16/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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