| 摘要 |
This invention relates to magnetron sputtering apparatus, generally indicated at (10), comprising a vacuum chamber in which is disposed a support (12) for semi-conductor wafers and a cathode (13) bearing target material (14). A magnetic array (18) is mounted for rotation external to the chamber (11) to create a non-zero field at or adjacent any point on the target during a cycle of the array, which can be rotated about an axis (19) by means of a motor (21). |
