| 发明名称 |
ELECTRONIC DEVICES INCORPORATING CARBON FILMS |
| 摘要 |
An improved semiconductor device (31) and manufacturing method for the same is described. The device is provided with an interleaved carbon pattern (34). Heat produced in the semiconductor device can be quickly dissipated and undesirable temperature elevation can be prevented due to the high thermal conductivity of the carbon pattern. |
| 申请公布号 |
EP0327336(A3) |
申请公布日期 |
1990.10.31 |
| 申请号 |
EP19890300962 |
申请日期 |
1989.02.01 |
| 申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
YAMAZAKI, SHUNPEI |
| 分类号 |
C23F4/00;H01L21/31;H01L21/314;H01L23/29;H01L23/373;H01L23/532;(IPC1-7):H01L23/36;H01L23/48 |
主分类号 |
C23F4/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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