发明名称 METHOD OF PRINTING METALLIC PASTE FOR THICK FILM CONDUCTOR
摘要 <p>PURPOSE:To control the thickness of a conductor layer to the specified thickness so as to obtain a specified resistance value by printing metallic paste for thick film conductor formation, which has the specified values for both values of viscosity and thixotropy index, on a green sheet. CONSTITUTION:The printing is done using metallic paste for thick film conduc tor formation which has such viscosity as to meet the relation of y=133t-660 at 0.924 for correlation coefficient, when the thixotropy index of metallic paste for thick film conductor formation to be printed on the surface of a green sheet is put in the range of 7-11, and thixotropy index is defined as t and the viscosity of metallic paste for thick film conductor formation is defined as y. Hereupon, if the thixotropy index is under 7, conductor thickness is not more than the specified value, which is too thin, and if it is over 11, the paste is too hard, with which printing property deteriorates. Hereby, desired values of conductor layer thickness and conductor layer resistance can be obtained.</p>
申请公布号 JPH02266591(A) 申请公布日期 1990.10.31
申请号 JP19890088283 申请日期 1989.04.07
申请人 FUJITSU LTD 发明人 NARUSE MASATO
分类号 C09D5/24;C09D11/00;C09D11/52;C09D17/00;H01B13/00;H05K1/09;H05K3/12;(IPC1-7):H05K3/12 主分类号 C09D5/24
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