| 摘要 |
PURPOSE:To enable infrared solder reflowing by providing a clamping member made of a nonconductive inorganic material adhered to the inner lead part of a lead. CONSTITUTION:A securing frame 3a made of alumina ceramics having high close contact with resin, high insulation and high mechanical strength is secured onto the outer periphery of a wire coupling part of an inner lead part 5-2. The frame 3a formed by molding alumina powder in a mold, baking it, providing a metallized layer 7 made of Mo-Mn at positions corresponding to leads, and then surface processing it with a nickel-gold plating layer 8. The surface processed frame 3a is wired with fine metal wirings 2, and adhered to a silver- plated layer 10 with leads with silver-tin-lead solder 9. With such a package structure, the leads have rigid adhering strength with the frame. Accordingly, it can prevent lateral deviation of the resin feasibly occurring in a boundary between the lead and the resin to prevent wirings, the resin from cracking. Thus, infrared solder reflowing, etc., can be performed.
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