| 摘要 |
<p>The flat grind stage assembly (10) is programmed so that the grinding wheel (14) is first caused to move along a straight path to form a flat on a wafer (w) while the wafer is held in a stationary position. Thereafter, the grinding wheel (14) is returned to the mid-point of the flat and then moved away from the flat commences when the end of the flat is reached so that a circular periphery is ground on the remainder of the wafer while the axis of the grinding wheel remains stationary.</p> |
