| 摘要 |
<p>Electrical apparatus is disclosed in which heat from a semi-conductor chip (10) is conducted through a piston member (26) to a housing (16) from which the heat is dissipated. The piston has circumferential grooves (40) and registering longitudinal side grooves (42). The grooves (40) are initially filled with a low melting point, thermally conductive material, such as amber wax. A central bore (33) registering with radial grooves (34) is similarly initially filled with the material. When the assembly is appropriately heated, the material melts and under gravity and capilliary flow fills the interfaces between the end of the piston and the chip and between the side wall of the piston and the cylinder wall. The lower edge of the grooves (40) are slanted to facilitate flow of the material.</p> |
