GINMETSUKIBUTSUPINOYOBISONOSEIZOHOHO

摘要

PURPOSE:To form a uniform and tough silver film on a substrate by plating by forming an Ni-Cu alloy film on the substrate as an underlayer by plating before silver plating. CONSTITUTION:A substrate is coated with an Ni-Cu alloy film as an underlayer by plating with an electroless Ni-Cu alloy plating soln. contg. alkali hypophosphite as a reducing agent by an immersion or pouring system. A molded body or powder may be used as the substrate. A silver film of a prescribed thickness is then formed on the coated substrate by carrying out a plating reaction while pouring an electroless silver plating soln. on the substrate.