| 摘要 |
PURPOSE:To assure high precision high density packaging by providing an opening in an insulating layer resistance part covering a resistor and a conductor therewith. CONSTITUTION:A resistance value trimming opening 7 is partially made in an insulating layer 4 on a resistor 3 of a ceramic substrate 1, following a trimming process, and trimming of a resistance value is effected through the opening 7 to yield a high precision resistor. Further, a conductor 2, a resistor 3 and an overcoating material 6 are printed on the insulating layer 4 on the resistor 3 avoiding the resistance value trimming opening 7 to form a thick film multilayered substrate with the resistor 3 provided below the insulating layer 4. Thus, high precision high density packaging can further be developed. |
