发明名称 |
Cantilever semiconductor device |
摘要 |
A semiconductor device comprising a semiconductor body having a depression formed into the first surface of the body. The device further comprises member means comprising a thermal-to-electric transducer or static electric element, the member means having a predetermined configuration suspended over the depression. The member means is connected to the first surface so that the predetermined configuration is cantilevered over the depression, the depression opening to the first surface around at least a portion of the predetermined configuration. The depression provides substantial physical and thermal isolation between the element and the semiconductor body. In this manner, an integrated semiconductor device provides an environment of substantial physical and thermal isolation between the transducer or element and the semiconductor body.
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申请公布号 |
US4966037(A) |
申请公布日期 |
1990.10.30 |
申请号 |
US19850782188 |
申请日期 |
1985.10.01 |
申请人 |
HONEYWELL INC. |
发明人 |
SUMNER, JOHN P.;JOHNSON, ROBERT G.;HIGASHI, ROBERT E. |
分类号 |
G01F1/696;G01P5/12;H01L27/02;H01L37/02 |
主分类号 |
G01F1/696 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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