IC CHIP PROVIDED WITH BUMP,申请号JP19890085246-传众专利搜索

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发明名称	IC CHIP PROVIDED WITH BUMP
摘要
申请公布号	JPH02263449(A)	申请公布日期	1990.10.26
申请号	JP19890085246	申请日期	1989.04.04
申请人	TOPPAN PRINTING CO LTD	发明人	SEKINE HIDEKATSU;TOKI SOTARO
分类号	H01L21/60;(IPC1-7):H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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