发明名称 MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To uniformize the thickness of an insulating film, prevent dielectric breakdown of the insulating film, and protect short circuiting between a word line and a capacitance electrode, by a method wherein the insulating film surrounding a capacitor electrode is formed by combining a thermal oxide film and an insulating film formed by CVD method. CONSTITUTION:By CVD method, a CVD oxide film 8 is grown; then by heat treatment, the CVD oxide film 8 is hardened, by selectively etching the CVD oxide film 8 and an insulating film 5c, a semiconductor substrate 1 is exposed, and an insulating film 9 is formed; next by thermal oxidation, a gate oxide film 6a is formed; a polycrystalline silicon layer is grown on the insulating oxide film 9 and the gate oxide film 6a; by photo etching method, selective etching is performed, and a word line 7a is formed. Thereby a shape wherein the insulating film 9 locally, thinly permeates with distortion is not caused, and short circuiting with etching residue of the word line 7a does not generate.
申请公布号 JPH02263461(A) 申请公布日期 1990.10.26
申请号 JP19890085235 申请日期 1989.04.03
申请人 NEC YAMAGUCHI LTD 发明人 NAGAYASU KATSUYUKI
分类号 H01L23/52;H01L21/3205;H01L21/822;H01L21/8242;H01L27/04;H01L27/10;H01L27/108 主分类号 H01L23/52
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