| 摘要 |
PURPOSE:To improve heat-resisting property by constituting the title device of a layer containing a thermosetting resin composite in which copolymer comprising imidounsaturated dicarboxylic anhydride and aromatic vinyl composite is blended with epoxy resin and halogenated epoxy resin, and metallic foil. CONSTITUTION:The device is thermocompression-molded in putting together metallic foil and prepreg comprising a base material being applied or infiltrated with a thermosetting resin composite in which imido-copolymer in reaction of maximum 90mole% ammonia or primary amine with respect to the acid anhydride group in copolymer to copolymer comprising imidounsaturated dicarboxylic acid anhydride and aromatic vinyl composite is blended with epoxy resin and halogenated epoxy resin, moreover, the unsaturated dicarboxylic anhydride group/epoxy group is 0.5-5.0 at an equivalent ratio. There may be given maleic anhydride, 2-chloromaleic anhydride, 2-phenlmaleic anhydride or the like as unsaturated dicarboxylic acid, and styrene, alpha-methylstyrene, chlorostyrene or the like. Whereby a lamination board with excellent thermoresistance, long duration of life, and high reliability can be obtained. |
