发明名称 RESIN SEALING METHOD OF ELECTRIC PARTS AND ITS STRUCTURE
摘要 PURPOSE:To unnecessitate solder bonding, reduce the number of processes and formation time, increase yield, and realize a constant outer size, by inserting elements and a terminal plate in an inner case, and applying resin seal in the state that the terminal plate is fixed by pressure on an electrode surface of the element. CONSTITUTION:Elements 6, 8 and a terminal plate 16 are inserted in an inner case 12, which is set in a metal mold; resin sealing is performed in the state that the terminal plate 16 is fixed by pressure on an electrode surface 11 of the element 6, from the side surface of the inner case 12. For example, in the case of a varistor arrester coupling parts constituted of two kinds of arresters and two kinds of varistors, the above inner case 12 is formed in a half- cylindrical type by using thermoplastic resin such as 66 nylon, P.B.T. and P.C., or thermosetting resin such as epoxy resin and phenol resin; on one side, an aperture 13 for inserting each element is formed; in the inside, a space 14 for accommodating the arrester element 8, a space 15 for accommodating the varistor element 6, and a space 17 for accommodating the terminal plate 16 are furnished.
申请公布号 JPH02262302(A) 申请公布日期 1990.10.25
申请号 JP19890081576 申请日期 1989.04.03
申请人 ASAMA GOSEI JUSHI KOGYOSHO:KK 发明人 WATANABE YOSHIMICHI
分类号 B29C39/10;B29C39/42;B29K105/20;B29L31/34;H01C1/024;H01C7/10;H01C17/02;H01G2/10;H01G4/224;H01G13/00 主分类号 B29C39/10
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