发明名称 DODENSEIJUSHISOSEIBUTSUOYOBISONOSEIKEIHIN
摘要 PURPOSE:To form a conductive resin composition having excellent conductivity and being free from lowering in conductivity even at high temperatures, by coating the surface of a conductive filler with a flux-containing thermoplastic resin, pelletizing the resulting filler to form master pellets, and mixing these pellets with pellets of an antioxidant-containing thermoplastic resin. CONSTITUTION:This conductive resin composition is formed by coating the surface of a conductive filler comprising a conductive fiber and a low-melting metal with a thermoplastic resin containing a flux (C), cutting the product into pellets and mixing the obtained master pellets with pellets of a thermoplastic resin containing an antioxidant. A conductive resin molding can be obtained by injection-molding this composition at a temperature >= the melting point of the low-melting metal. A copper fiber is the most desirable as said conductive fiber. An example of said low-melting metal is a soldering alloy based on Sn or Sn-Pb.
申请公布号 JPH0248588(B2) 申请公布日期 1990.10.25
申请号 JP19880030145 申请日期 1988.02.12
申请人 TOSHIBA CHEM PROD 发明人 HABATA KEIICHI;FUKUMOTO HIROTERU;IWASE HIDEHIRO
分类号 C08K13/04;C08K7/00;C08K7/04;C08K9/08;C08L101/00;H01B1/20 主分类号 C08K13/04
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