A METHOD OF PRODUCING A SEMICONDUCTOR DEVICE

摘要

In semiconductor device production, each chip (12) on a wafer (10) is, after testing, identified with identification data (C1, C2..Ci) that is both human and machine readable. The chip identification is then used in sorting, storing, testing, assembling and failure analysis. The identification usage at these process steps eliminates chip part number mix-up and placement. It provides data used for quality control.